E Beam Evaporator
RS mapping
MgO Process
Glow discharge (Option)
Process Condition
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MgO on glass substrate
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Deposition temperature :100 ℃
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Thickness : 5000Å
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Deposition rate : 3 Å/s
Ni deposition test
Sample surface cleaning by Plasma (option)
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Improve film adhesion and quality
Process D (ITO + Conventional Dome)
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ITO (density 7.18) Evaporation + Heating
SEE - 5
SPECIFICATIONS
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Deposition materials : Metal : Ag, Al, Au, Cu, Sn, Ti, Pt, Ge, Ni, Au,..
Oxide : SiO2, TiO2, Al2O3, Ta2O5,…
TCO : ITO,… -
Substrate size : Max. 8 inch
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Product yield : 5 wafers/run@4inch, 3 wafers/run@6inch
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Lamp heater : Max. 200℃
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E-beam gun : 15ccx6pk , 25ccx4pk or 7cc*4pk
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E-beam power supply : 6KW or 10KW
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Pocket selector : 6 pocket indexer
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Beam sweep controller : Digital sweep control
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Thickness controller : Single Q’tz crystal sensor & controller
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Ultimate pressure : < 5.0E-7 Torr (Cryo pump or TMP)
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Control : PC control (UPRO software)
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Option : Loadlock chamber, Ion source, substrate cooling- tilting & rotation
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Dimension : (W*D*H)1,010mm X 1,460mm X 1,790mm
SEE - 7
SPECIFICATIONS
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Deposition materials : Metal : Ag, Al, Au, Cu, Sn, Ti, Pt, Ge, Ni, Au,..
Oxide : SiO2, TiO2, Al2O3, Ta2O5,…
TCO : ITO,… -
Substrate size : Max. 8 inch
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Product yield : 22 wafers/run@4inch, 9 wafers/run@6inch, 3 wafers/run@8inch
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Lamp heater : Max. 200℃
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E-beam gun : 40ccx4pk, 25ccx4pk, 15ccx6pk or 7cc*4pk
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E-beam power supply : 6Kw , 10Kw OR 15Kw
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Pocket selector : 6 pocket indexer
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Beam sweep controller : Digital sweep control
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Thickness controller : Single Q’tz crystal sensor & controller
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Ultimate pressure : < 5.0E-7 Torr (Cryo pump or TMP)
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Control : PC control (UPRO software)
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Option : Dual electron gun, Ion source, Planetary dome, Double or 6 crystal sensors
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Dimension : (W*D*H)1,010mm X 1,460mm X 1,790mm
SEE - UHV
SPECIFICATIONS
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Deposition materials : Metal : Ag, Al, Au, Cu, Sn, Ti, Pt, Ge, Ni, Au,..
Oxide : SiO2, TiO2, Al2O3, Ta2O5,… -
Substrate size : Max. 4 inch
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Product yield : 1 wafers/run@4inch
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E-beam gun : 6ccx4pk
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E-beam power supply : 6Kw
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Pocket selector : 4 pocket indexer
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Beam sweep controller : Digital sweep control
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Thickness controller : Single Q’tz crystal sensor & controller
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Ultimate pressure : < 2.0E-9 Torr (Cryo pump )
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Loadlock Chamber Pressure : < 5.0E-6 Torr (TMP )
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Control : PC control (UPRO software)
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Option : Ion source, Sputter gun, substrate cooling- tilting & rotation, Substrate temperature max. 700℃
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Dimension : 3,000mm X 800mm X 1,700mm