walter
Lemmen
PCB Processing Equipment for prototypes and small series for industrie, research & development and schools
Precision In Detail
Equipment for the manufacture of printed circuit boards
PCB Technology
• One and double sided PCBs
• Through hole plated PCBs
• Multilayer up to max. 6 layers
• RF circuit boards
• LTCC - Ceramic
• MID-Wafer Technology
• HDI Micro via Technology
• Flex and Flex-rigid Board Technology
• Thick Copper Board Technology
• Insulated Metal Substrate (IMS-Board Technology)
• Structuring of non-ferrous metals, stainless steel and
aluminum front panels and labels
Equipment for the manufacture of printed circuit boards
The demand for finer and more complex structures, small components and flexible materials is growing rapidly. As a result, the company is expected to be fast and flexible in implementing the new technologies with available high quality equipment. The Walter Lemmen Ltd. has a perfectly matched equipment program. It covers the entire manufacturing process to produce high quality printed circuit boards with complex structures.
Additionally it covers fine conductor plates, widths and distances on different base materials. The product lines from the Walter Lemmen Ltd. ranges from systems for structuring, surface treatment and through hole plated systems. Surface facilities for the protection of one and double sided printed circuit boards, chemical milled parts and multilayer are also included. Our product range is complemented by environmentally friendly production technologies. This includes a high level of safety standards, reduction of environmental pollution, lower consumption of raw materials, chemicals, energy and water. Integrated rinsing and filtration technology, regeneration equipment, waste water treatment plants and electrolytic cells used for the complete recovery of precious metals from the rinse water process are reflected in our products.
Film processing • Exposure • Lamination
Inexpensive and very effective devices are available for the technical film processing procedure especially for the production of prototypes. This ranges from photoplotters for the production of high-quality films for subsequent processes, to one and double-sided working UV exposure units. The professional design of the photoplotters allow the processing of standard CAD data, which guarantee an optimal film exposure result on the UV exposure systems. They are available in different sizes and designs. A special UV technology in combination with a drawer vacuum system and a wide range of device equipment, ensure an optimal exposure result and short exposure times.
The high quality UV-LDI direct imagine system (Laser-Technology) is the ideal solution for a fast, accurate and robust prototyping of printed circuit boards and etched parts. It exposes all standard UV sensitive materials, such as negative dry resist, positive resist or solder mask. The UV LDI direct imagine system (Laser Technology) exposes the layout in a short time and without any mask. There are already provided for in the basic-version resolution of 75μm line width and spacing.
Our powerful laminators can be used for the processing of all usual photostructurable laminates and photopolymer film (solder mask), printed circuit board production and chemical milled parts production. The laminators ensure an optimum lamination result.
Brushing • Cutting • Drilling
A wide product range of manual and motorized sheet shears are available, for cutting of circuit boards, metal sheets and aluminum. The different device models provide the perfect cut and accurate edges. For professional drilling and routing of circuit boards, metal parts, plastic and front panels, we offer manually operated precision drilling machines. They are specifically designed for the prototype production, which guarantee a high level of drilling quality and usability. Our CNC controlled drilling and milling machines with manual or automatic tool changer works with high accuracy, resolution and step drilling frequency. The stable aluminum construction allows for processing multiple panels and can also be used for isolation routing of circuit boards and aluminum front panels.
Lemmen‘s compact brushing machines can be used universally for different materials and substrates include laminating or deburring, after drilling in the print production. Special devices of single or double-sided working table units or floor units are also available.
The machines through its easy handling and stable construction have a wide scope in the mechanical circuit board processing. Which combines the adjustable transport speed and the modulation oscillator devices.
Developing • Etching • Rinsing • Stripping
The modular designed etching and developing devices of Lemmen Ltd.,allow for fast processing of printed circuit boards in the spray-etching and development process, foam-etching process or continuous spray-etching process. This provides the perfect premise for a high-quality printed circuit board image. Special holders allow the customer to edit different PCB materials in the manual or vertical method of process running. The floor-mounted or table units in a compact construction include all process steps from developing, etching and rinsing (optional stripping) in one unit and enable the production of high quality PCB structures of 50-100 microns. The units are designed for prototypes and small series of up to a suitable plate size of 500 x 600 mm.
The laboratory bench systems of series MINISTAR and the floor-mounted units of the series ETCHING CENTER V are used for developing, etching and rinsing in foam etching process and continuous development process. They are ideal for the processing of small printed circuit boards and etched plates in laboratories, schools and institutions to create professional sample sheets and prototypes.
The spray development and spray etching units, ETCHING CENTER S and CONVERT from Lemmen Ltd., are suitable for the production of fineline single or double-sided printed circuit boards or chemical milled parts. The systems are available either manually or vertically, which are operating systems with integrated rinsing moduls. Our new rotation spray systems give uniformity and intensive treatment to the entire surface. The units are equipped with multiple rinses which is characterized by their clean and compact way of working. The modular design allows expansion of the units by a stripper and dryer module.
Through hole plated technology
The creation of high-quality printed circuit boards and multilayers require high precision and systems engineering for the metallization of the holes, soldering of the contacts and finishing, which protects against oxidation and corrosion. To create the through-hole plated printed circuit boards, the PCBs must be pretreated by a wet chemical process, by metallizing the substrate inside the hole and therby establishing connection between the individual layers. For the through-hole plating galvanic process we offer our range COMPACTA, as a general-purpose electroplating plant, for the chemical or electrochemical treatment of metals in vertical technology. In consultation with the customers requirements the desired through-hole plating system is constructed.
The general production of high quality through-hole printed circuit boards, is based on an evironmentally friendly direct metallizing with graphit as catalyzer, in tenting or subtractive process.
The modular design of the systems provides the ability to integrate additional processes into the system concept: desmearing, blackening, tin stripping, resist stripping, immersion tin and organic protective coating (OSP), immersion nickel / gold, immersion silver, electroplated nickel / gold. The treatment and rinsing tanks are optimally fitted with high-quality facilities and system components which guarantee an optimal result for printed circuit board.
Multilayer
Multilayer production is used to achieve a high level of information on a printed circuit board. The multilayer presses of the MLP-L series are devices for the production of multilayer printed circuit boards (Multilayers) for prototyping and small-scale production. The device has two separate controlled, electrically heated press plates. The hydraulic system can be controlled by an integrated SPS touch panel. The extensive functionality of the multilayer press of MLP-L series allows the use for various manufacturing processes. In combination with the exposure, development, etching and through-hole plated units, high-quality multilayers can be manufactured in a short period of time.
Final Finishes • protective layers
Organic, chemical or galvanic protective coatings are used for oxidation and corrosion protection of PCB surface finishes. A high quality surface finish on PCBs is guaranteed through the use of special equipment in combination with chemical processes. The final surface treatment of different PCB types can be integrated as an additional process, eg. in the COMPACTA device or as a single unit in the series PROTEC. The system configuration depends on different chemical treatments
for the surface protection of the respective processes:
Systems for lead-free surface
- Electroless Nickel / Gold
- Immersion Tin
- Immersion Silver
- Organic surface protection (OSP)
Equipment for special applications
- Galvanic Nickel / Gold
- Galvanic Silver
Drying • Tempern
The printed circuit board process dryer is designed in a vertical position. This provides a rapid residue-free drying of PCBs, chemical milled parts, non-ferrous metals or other etched substrates by the wet chemical process. The circuit board is automatically transported through the drying zone and is the subsequent processing step of laminating and quick surface treatment. The program is expanded by the universal use of ovens for drying, tempering and heating circuit boards and substrates. The quality of the stainless steel ovens offer a variety of facilities and program function. The application specific options are easy to use and ensure a wide range of applications.
