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DRY ETCHER

Hole Pattern

Cross-view of MESA etching

Silicon 20nm Silp Line Etching

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Cross-view of Poly Silicon Etching

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Cross-view of Silicon Etching

Trench Pattern

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PERI - R Series

SPECIFICATIONS
  • Application : Metal & Dielectric material etching

  • Etching material : SiO2, Si3N4, Si, Al, GaN, HfO2, Al2O3,Graphene,…

  • Substrate size : Piece ~ 12inch

  • Product yield : 1(one) wafer/run

  • Source(gas) injection type : Dual patterned showerhead type

  • Power supply : RF power Max. 2Kw@13.56MHz (with RF matching network)

  • Ultimate pressure : < 5.0E-3 Torr

  • Pressure control : Auto pressure control (throttle valve, baratron gauge)

  • Gas delivery : SF6, CHF3, CF4, C4F8, BCl3,Cl2O2, Ar, He,…

  • Vacuum pump : Dry pump or Rotary pump

  • Control : PC control (UPRO software)

  • Option : TMP, Loadlock chamber

  • System dimension (W*D*H) : 800mm X 880mm X 1,200mm

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PERI - L SERIES

SPECIFICATIONS
  • Application : Metal & Dielectric material etching

  • Etching material : SiO2, Si3N4, Si, Al, GaN, HfO2, Al2O3,Graphene,…

  • Substrate size : Piece ~ 12inch

  • Product yield : 15 wafers/run

  • Source(gas) injection type : Dual patterned showerhead type

  • Power supply : RF power Max. 2Kw@13.56MHz (with RF matching network)

  • Ultimate pressure : < 5.0E-3 Torr

  • Pressure control : Auto pressure control (throttle valve, baratron gauge)

  • Gas delivery : SF6, CHF3, CF4, C4F8, BCl3,Cl2O2, Ar, He,…

  • Vacuum pump : Dry pump or Rotary pump

  • Control : PC control (UPRO software)

  • Option : TMP, Loadlock chamber

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PERI - ICP SERIES

SPECIFICATIONS
  • Etching material : Metal & Dielectric material etching

  • Substrate size : Max. 8inch

  • Product yield : 1(one) wafer/run

  • Source(gas) injection type : Showerhead type

  • Chuck Unit : Chuck cooling by chiller
                          Substrate back side He cooling
                          Mechanical wafer chucking with clamp

  • Power supply : Bias : RF power Max.2kW@13.56MHz
                              ICP source : RF power Max.3kW@13.56MHz

  • Ultimate pressure : < 5.0E-6 Torr (TMP & Dry pump)

  • Pressure control : Pendulum valve, baratron gauge

  • Gas delivery : SF6, CHF3, CF4, C4F8, BCl3,Cl2O2, Ar, He,…

  • Control : PC control (UPRO software)

  • Option : TMP, Loadlock chamber

  • System dimension (W*D*H) : 2,050mm X 800mm X 1,600mm

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