THERMAL EVAPORATOR
3D junction network nano structure deposition
Metal & Co-evaporation deposition
Bio application deposition
Physically synthesized Au nanodisks
Process data
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Ag Thickness Measurement Test
X-ray detector deposition [CsI]
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Au material ; nano structure_SEM image (surface)
Process data
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Nano structure by deposition material_SEM image (surface)
EASYDEP - 3M
SPECIFICATIONS
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Deposition materials : Metal : Ag, Al, Au, Cu, Sn, Ti, Ni,...
Oxide : MoO3, NiO, WO3,..
Bio device -
Substrate size : Max. 8 inch
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Product yield : 3 wafers/run (@4inch wafer)
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Substrate rotation : 0 to 20 rpm
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Substrate holder : [Option] – Heating, Tilting, Cooling & Rotation
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No of boats : 1 to 4 ea
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Thermal power : 1.5 to 3 kw
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Thickness controller : Single Q’tz crystal sensor & controller
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Ultimate pressure : < 5.0E-7 Torr (Cryo pump or TMP)
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Option : Co-evaporation
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Control : Manual control
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Dimension (W*D*H) : 650mm X 1,280mm X 1,900mm
EASYDEP - 5
SPECIFICATIONS
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Deposition materials : Metal : Ag, Al, Au, Cu, Sn, Ti, Ni,...
Oxide : MoO3, NiO, WO3,..
Bio device -
Substrate size : Max. 8 inch
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Product yield : 4 wafers/run (@4inch wafer)
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Substrate rotation : 0 to 20 rpm
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Substrate holder : [Option] – Heating, Tilting, Cooling & Rotation
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No of boats : 1 to 4 ea
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Thermal power : 1.5 to 3 kw
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Thickness controller : Single Q’tz crystal sensor & controller
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Ultimate pressure : < 5.0E-7 Torr (Cryo pump or TMP)
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Option : Co-evaporation
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Control : Manual control
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Dimension (W*D*H) : 900mm X 1,150mm X 1,950mm
EASYDEP - 7
SPECIFICATIONS
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Deposition materials : Metal : Ag, Al, Au, Cu, Sn, Ti, Ni,...
Oxide : MoO3, NiO, WO3,.. -
Substrate size : Max. 400mm x 400mm
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Product yield : 22 wafers/run@4inch, 9 wafers/run@6inch, 3 wafers/run@8inch
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Substrate rotation : 0 to 20 rpm
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No of boats : 1 to 6 ea
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Thermal power : 1.5 to 3 kw
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Thickness controller : Single Q’tz crystal sensor & controller
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Ultimate pressure : < 5.0E-7 Torr (Cryo pump or TMP)
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Option : Co-evaporation, Substrate Heating
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Control : PC control (UPRO software)
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Dimension (W*D*H) : 1,600mm X 1,450mm X 2,060mm
EASYDEP - N
SPECIFICATIONS
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Application : Nano structure deposition (3D junction network nano structure deposition)
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Deposition materials : Metal : Ag, Al, Au, Cu, Pd, Ti,... Oxide : SnO2, ZnO, WO3,..
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Substrate size : Max. 6inch wafer
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Product yield : 1 wafers/run@6inch
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Substrate rotation : 0 to 20 rpm
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No of boats : 1 to 2 ea
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Thermal power : 1.5 to 3 kw
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Thickness controller : Single Q’tz crystal sensor & controller
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Ultimate pressure : < 5.0E-7 Torr (Cryo pump or TMP)
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Auto Pressure Control : Baratron gauge + throttle valve
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Option : Co-evaporation, Substrate Heating
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Control : PC control (UPRO software)