SPUTTER
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Target Material : PZT
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Sample Size: 25sccm
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Working Pressure : 7mTorr
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Power : RF 100W
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Temp : R.T
PZT target process data
Cu under 5mTorr AR @ 100W, 1 min.
MOON series (Cu & Ag SEM Images
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Target Material : RuO2
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Sample Size: 4 "
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R.F Power : 200W
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Working Pressure : 7mTorr
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Gas : Ar flow
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Gun : 4 Inch
TERRA - P
SPECIFICATIONS
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Deposition materials : Oxide materials, TCO materials, Metal materials
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Substrate size : Piece to 8 inch
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Product yield : 1 wafer/ run(@8 inch)
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Sputter gun size : 3 inch to 12 inch
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Plasma power : RF, DC or Pulsed DC power
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Pressure control : Auto pressure control (throttle valve and baratron gauge)
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Process gases : Ar, O2, N2
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Substate Temperature : RT to Max. 450℃
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Vacuum pump : TMP or Cryo pump + Rotary pump or Dry pump
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Ultimate pressure : < 5.0E-7 Torr
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Option : Loadlock chamber, Substrate rotation, Substrate temperature max.650℃
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Control : PC control (UPRO software) or Manual
TERRA - T
SPECIFICATIONS
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Deposition materials : Oxide materials, TCO materials, Metal materials
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Substrate size : Piece to 8 inch
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Product yield : 1 wafer/ run(@8 inch)
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Sputter gun size : 3 inch to 12 inch
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Plasma power : RF, DC or Pulsed DC power
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Pressure control : Auto pressure control (throttle valve and baratron gauge)
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Substrate rotation : 0~ 20 rpm
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Process gases : Ar, O2, N2
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Substate Temperature : RT to Max. 450℃
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Vacuum pump : TMP or Cryo pump + Rotary pump or Dry pump
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Ultimate pressure : < 5.0E-7 Torr
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Option : Loadlock chamber, Plasma cleaning, Substrate cooling, Substrate temperature max.650℃
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Control : PC control (UPRO software) or Manual
TERRA - R
SPECIFICATIONS
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Deposition materials : Oxide materials, TCO materials, Metal materials
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Substrate size : Piece to 6 inch
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Product yield : 10 wafer/ run(@4 inch)
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Sputter gun size : 4 inch to 8 inch
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Plasma power : RF, DC or Pulsed DC power
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Pressure control : Auto pressure control (throttle valve and baratron gauge)
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Substrate rotation : 0~ 20 rpm
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Process gases : Ar, O2, N2
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Substate Temperature : RT to Max. 450℃
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Vacuum pump : TMP or Cryo pump + Rotary pump or Dry pump
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Ultimate pressure : < 5.0E-7 Torr
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Option : Substrate temperature 250℃, Thermal evaporation boat
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Control : PC control (UPRO software) or Manual
TERRA - C
SPECIFICATIONS
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Deposition materials : Oxide materials, TCO materials, Metal materials
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Substrate size : Piece to 8 inch
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Product yield : 1 cassette (25wafers/ run)
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Sputter gun size : 4 inch to 12 inch
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No. of Process Chamber : Up to 5 nos. PM
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Transfer Chamber : Vacuum robot
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Casette Chamber : 1 cassette
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Plasma power : RF, DC or Pulsed DC power
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Pressure control : Auto pressure control (throttle valve and baratron gauge)
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Substrate rotation : 0~ 20 rpm
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Process gases : Ar, O2, N2
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Substate Temperature : RT to Max. 450℃
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Vacuum pump : TMP or Cryo pump + Rotary pump or Dry pump
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Ultimate pressure : < 5.0E-7 Torr
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Option : Substrate rotation, Substrate cooling, Plasma cleaning, Substrate temperature max.650℃
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Control : PC control (UPRO software)
TERRA-MOON
SPECIFICATIONS
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Application : In situ one side or double side metal coating
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Deposition materials : Metal materials- Ag, Cu, Ni, Ti,…
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Substrate size : Piece to 4 inch, Rectangular type
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Product yield :Depending on sample size
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Sputter gun size : Small to 800mm*150mm*10mm(T)
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No. of Sputter gun : Up to 4 nos
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Plasma power : RF, DC or Pulsed DC power
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Pressure control : Auto pressure control (throttle valve and baratron gauge)
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Substrate rotation : 0~ 20 rpm
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Process gases : Ar, O2, N2
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Vacuum pump : TMP or Cryo pump + Rotary pump or Dry pump
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Ultimate pressure : < 5.0E-7 Torr
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Option : Double site metal coating, Plasma cleaning
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Control : PC control (UPRO software) or Manual